Due to COVID-19, IWPMA 2021 was organized as a web conference. The IWPMA-Board decided to organize IWPMA 2021, which was the 18th workshop in this series, as a web conference in order to give an opportunity for participation and presentation, especially for young scientists, who would otherwise have the risk of a delay in their career. The conference was co-organized by Leibniz Universität Hannover and Penn State University. The on-site conference which was planned to be held in Nanjing, China, is postponed to 2022. Details for this conference will be forthcoming.
Conference Topics
Piezoelectric material & structures
- Synthesis and elaboration: ceramics, polymers, single crystals, lead-free materials
- Manufacturing processes
- Characterization
- Piezoelectric material & structures
- Multiferroic materials and systems
Modeling & Characterization
- Multi-physics modeling involving piezoelectric/flexoelectric effects
- Piezoelectric material and device modeling
- Experimental methods
- Numerical methods
Devices and Systems
- N/MEMS devices (actuators and sensors)
- Electrical interfaces for energy harvesting
- Composite sensors/actuators
- Energy harvesting structures
- Ultrasonic and acoustic devices
- Piezoelectric transformers
- Solid state actuators
- Piezo-based structural health monitoring
- Drive circuits for piezoelectric devices
Special Session: Electrocaloric Materials and Devices
October 26, 2021
This special session on electrocaloric materials and devices will cover the recent advances in research and development of both thin and thick film materials and their implementation in cooling technology. The topics to be presented include – Electrocaloric materials; Device architectures for cooling / heat pumping; Multiphysics coupled models for electrocaloric cooling devices; Thermal absorbers and heat sink designs for electrocaloric cooling devices; Numerical model for describing thermal circuits with respect to electrocaloric coolers; Control systems for electrocaloric cooling devices; Manufacturing approaches for subsystems: and On-chip cooling technology. Presentations will include a mixture of invited (20 minutes) and contributed (10 minutes) talks.
